On Tuesday, 12th May 2026, the Italian Chamber of Commerce in China (CCIC), together with its Mechanical Engineering Working Group (MEWG) and in collaboration with Porsche Consulting, successfully held the MEWG members’ meeting titled “From Chips to Systems: China’s Broader Path to AI” at the Dobe WE International Hub at Bund, in Shanghai. The event gathered around 15 participants from the sector, offering MEWG members the opportunity to explore the evolution of China’s semiconductor industry and its growing connection with artificial intelligence, electric vehicles, robotics and industrial systems.
HIGHLIGHTS OF THE EVENT
The meeting opened with welcome remarks from Josef Nierling, Managing Director of Porsche Consulting Italy, connected online, and Jiawei Zhao, Managing Director & CEO of Porsche Consulting China.
Ziwei Xie, Senior Manager & Expert at Porsche Consulting, delivered the keynote presentation “From Chips to Systems: China’s Broader Path to AI”, focusing on semiconductors, AI, EVs, robotics and industrial ecosystems.
The event continued with a MEWG internal roundtable moderated by Riccardo Budriesi, President at Marposs China and Coordinator of the Mechanical Engineering Working Group, together with Mirko Turrina, General Manager of Goglio (Tianjin) Packaging Co., Ltd. and MEWG Vice Coordinator, with an exchange on market outlook and business sentiment in China’s mechanical engineering sector.
The meeting concluded with a networking refreshment offered by Porsche Consulting and ATTIMO, providing participants with the opportunity to continue the discussion in an informal setting.
The Italian Chamber of Commerce in China (CCIC) would like to thank all speakers and participants involved in the event, as well as Porsche Consulting for its valuable collaboration, Dobe WE International Hub at Bund for hosting the meeting, and ATTIMO for contributing to the final refreshment.
